Leading EDA Distributor to Provide Sales and Support for Expanding Korean Semiconductor Industry
 
SEOUL, KOREA and MOUNTAIN VIEW, CA – May 5, 2012 – Nimbic, a leading provider of Maxwell-accurate, 3D Full-Wave Electromagnetic Integrity solutions, today announced an exclusive agreement with Huwin, a leading EDA distributor and design consulting company in Korea. Huwin will immediately begin providing sales and technical support for customers in Korea.

“Korea is one of the fastest growing markets for high-technology semiconductor and chip-package-board solutions,” said Keith Morton, Nimbic vice president of worldwide sales. “We are seeing increased interest by leading customers in Korea in solving their signal integrity challenges. Nimbic is committing to long-term success of customers in Korea by partnering with Huwin.”

Huwin was founded in June 2010. Huwin has professional experience of over 10 years in signal integrity, power integrity and electromagnetic interference analysis for chip-package-board systems.

“We are thrilled to grow presence in Korea for a leading technology company with innovative solutions to signal integrity challenges as well as creative new EDA cloud-computing business models,” said Seung-il Jeung, CEO of Huwin. “We are confident that our many years of experience will help Nimbic establish solid presence in Korea.”

About Nimbic

Nimbic is the leading provider of Maxwell-accurate, 3D Full-Wave Electromagnetic Integrity solutions. Nimbic’s nWave 3D field solver enables fast, scalable signal integrity, power integrity and EMI analysis for chip-package-system design. Nimbic’s global customers include Texas Instruments, Renesas, Toshiba, Qualcomm, Tabula and Panasonic. Nimbic’s nCloud secure and scalable cloud compute platform facilitates electromagnetic integrity analysis for the most complex designs cost-effectively and in near real time. Nimbic is headquartered at 2063 Landings Drive, Mountain View, CA.

For additional information, please visit www.nimbic.com

About Huwin

Huwin Co., Ltd. (High-speed and U-Wave INtegrity), is committed to delivering simulation software and services related to high-speed digital and electromagnetic fields. Huwin’s specific expertise is on the automated extraction, analysis and reporting solution for high-speed chip-package-board-system design. Huwin is located at Bundang near Seoul.

For additional information, please visit www.huwin.co.kr

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Media Contact:

Bala Vishwanath, Chief Marketing Officer, Nimbic 800-686-5213 media@nimbic.com

Seung-il Jeung, Ph.D, CEO of Huwin, 031-719-5020 sijeung@huwin.co.kr

 
MOUNTAIN VIEW, CA – Wednesday, April 4, 2012 – Nimbic, the leading provider of Maxwell-accurate, 3D Full-Wave Electromagnetic Integrity solutions, today announced that Jim Hogan, Board of Director, Nimbic, will participate in talk titled “SoC Realization: The Next Horizon” at EDPS 2012 Symposium in Monterey, California.

Relentless push for higher quality user experience with minimum system cost and power are key. Feature convergence in Video, Voice, Data, etc. in consumer devices, led by the smartphone, is impacting SoC realization. Popularity of tablets is adding to the equation. What affect does this have on system companies relative to Fabless and IDMs? How will this impact the realization of SoC’s?

WHAT: SoC Realization: The Next Horizon
WHERE: EDPS 2012 Symposium Program, Monterey Beach Resort, 2600 Sand Dunes Drive, Monterey, CA 93940
WHEN: Thursday Dinner, April 5th, 2012
WHO: Jim Hogan, Board of Director, Nimbic

For additional information on the panel, visit http://www.eda.org/edps/edps_program.php

About Nimbic

Nimbic is the leading provider of Maxwell-accurate, 3D Full-Wave Electromagnetic Integrity solutions. Nimbic’s nWave 3D field solver enables fast, scalable signal integrity, power integrity and electromagnetic interference analysis for chip-package-system design. Nimbic’s global customers include Texas Instruments, Renesas, Toshiba, Qualcomm, Tabula and Panasonic. Nimbic’s nCloud secure and scalable cloud compute platform facilitates electromagnetic integrity analysis for the most complex designs cost-effectively and in near real time. Nimbic is headquartered at 2063 Landings Drive, Mountain View, CA.

For additional information, please visit www.nimbic.com

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Media Contact:

Bala Vishwanath, Chief Marketing Officer, Nimbic 800-686-5213 media@nimbic.com

 
MOUNTAIN VIEW, CA – Wednesday, April 4, 2012 – Nimbic, the leading provider of Maxwell-accurate, 3D Full-Wave Electromagnetic Integrity solutions, today announced that Dr. Don MacMillen, Vice President of Engineering, Nimbic, will present a paper titled “Electromagnetics Simulation using HPC in a Cloud” at EDPS 2012 Symposium in Monterey, California.

Several developments contribute to an increasing need for electromagnetic simulation of large chip ‐ package – board systems. First, the relentless march towards higher integration coupled with increased speeds, particularly for mobile devices. Second, packaging, in particular 3DIC technology is emerging as a major way to provide adaptability for speed and density while reducing power and form factor. Electromagnetic simulation is necessary to ensure design integrity of these large systems, requiring considerable computing resources. While High‐Performance Computing fits this bill, a more cost effective alternative is the use of large numbers of commodity computers, available for example in public and private clouds.

This paper presents the use of MPI (Message Passing Interface) on a cluster of computers connected by fast Ethernet for electromagnetic simulation of complex chip-package-board systems. An iterative boundary element method solver with matrix compression allows minimizing the communication among computer nodes, and facilitates static load balancing across the nodes. Matrix setup can be performed without communication among the nodes, as well as predictive load balancing based on accurate estimates of the compression efficiency.

The iterative solver itself only requires limited data transfer to collect matrix-vector products and to broadcast vectors for successive iterations. The electromagnetic simulator was implemented in the AWS cloud (Amazon Web Services). The paper ends presenting results that show scaling of both speed and memory (i.e. pooling the memory of all nodes in the cluster to act like one large memory) for clusters with up to 10 computers, each with 8 cores.

WHAT: Electromagnetics Simulation using HPC in a Cloud
WHERE: EDPS 2012 Symposium Program, Monterey Beach Resort, 2600 Sand Dunes Drive, Monterey, CA 93940
WHEN: Thursday PM, April 5th, 2012
WHO: Dr. Don MacMillen Vice President of Engineering, Nimbic

For additional information on the panel, visit http://www.eda.org/edps/edps_program.php

About Nimbic

Nimbic is the leading provider of Maxwell-accurate, 3D Full-Wave Electromagnetic Integrity solutions. Nimbic’s nWave 3D field solver enables fast, scalable signal integrity, power integrity and electromagnetic interference analysis for chip-package-system design. Nimbic’s global customers include Texas Instruments, Renesas, Toshiba, Qualcomm, Tabula and Panasonic. Nimbic’s nCloud secure and scalable cloud compute platform facilitates electromagnetic integrity analysis for the most complex designs cost-effectively and in near real time. Nimbic is headquartered at 2063 Landings Drive, Mountain View, CA.

For additional information, please visit www.nimbic.com

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Media Contact:

Bala Vishwanath, Chief Marketing Officer, Nimbic 800-686-5213 media@nimbic.com

 
MOUNTAIN VIEW, CA – Thursday, March 8, 2012 – Nimbic, the leading provider of Maxwell-accurate, 3D Full-Wave Electromagnetic Integrity solutions, today announced that Dr. Raul Camposano, Nimbic CEO, will moderate special session titled “Moore Meets Maxwell” to be held at DATE 2012 in Dresden, Germany.

Moore’s Law has driven the semiconductor revolution enabling over four decades of scaling in frequency, size, complexity, and power. However, the limits of physics are preventing further scaling of speed, forcing a paradigm shift towards multicore computing and parallelization. In effect, the system is taking over the role that the single CPU was playing: high-speed signals running through chips but also packages and boards connect ever more complex systems.

High-speed signals making their way through the entire system cause new challenges in the design of computing hardware. Inductance, phase shifts and velocity of light effects, material resonances, and wave behavior become not only prevalent but need to be calculated accurately and rapidly to enable short design cycle times. In essence, to continue scaling with Moore’s Law requires the incorporation of Maxwell’s equations in the design process. Incorporating Maxwell’s equations into the design flow is only possible through the combined power that new algorithms, parallelization and high-speed computing provide. At the same time, incorporation of Maxwell-based models into circuit and system-level simulation presents a massive accuracy, passivity, and scalability challenge.

In this tutorial, the panel members navigate through the often confusing terminology and concepts behind field solvers, show how advances in field solvers enable integration into EDA flows, present novel methods for model generation and passivity assurance in large systems, and demonstrate the power of cloud computing in enabling the next generation of scalable Maxwell solvers and the next generation of Moore’s Law scaling of systems. The panel members intend to show the truly symbiotic growing relationship between Maxwell and Moore!

Talk 1: Navigating Field Solvers for EDA
Speaker: Prof. Vikram Jandhyala, Chair, Department of Electrical Engineering,
University of Washington

There are a myriad of electromagnetic solvers of varying accuracy, scale, and speed with different applicability. Static, quasi-static, full-wave regimes are distinct, as are 2D, so-called 2.5D (layered) and 3D solvers. While static solvers suffice for digital on-chip capacitance and resistance extraction, system-level parasitic extraction necessitates a range of solvers. At higher frequencies, quasi-static solvers produce coupled inductance and capacitance matrices for chip, package and board structures. For handling the complete frequency range of many state-of the-art electronic systems, full-wave solvers are necessary. Different dimensionalities of solvers are also applicable in different scenarios. Efficient and simple two-dimensional solvers work well for cross sections, transmission lines, and cables. So-called 2.5D solvers use layered medium approximations to simplify material media. Such approaches work well for embedded passives in analog chips but have challenges when used for package or board structures. Another class of so-called 2.5D solvers uses symmetric or differential current flow assumptions to simplify the problems and ease computational time and memory. Such methods work well at low frequencies and with conservative designs, but fail for low-cost systems such as memory interfaces. 3D solvers can handle the complete generality of systems but have challenges in scalability unless fast algorithms and parallel methods can be developed. This talk clarifies how to choose the right electromagnetic solver for the right task in electronic design for a variety of challenging applications including: Parasitic extraction, inductive noise, power integrity, high-speed signal integrity, electromagnetic interferences, integrated antennas and radiators, and integrated passives in analog and RF circuits. This talk also focuses on the powerful finite element, finite difference, and method of moments class of solvers, and introduce novel algorithms for high-accuracy solution with dramatic acceleration and scalability. In the context of differential and integral equation methods, concepts such as boundary conditions, equivalent surfaces, source types, iterative and direct solvers, time stepping methods, and S-parameter generation and equivalent circuit generation are discussed.

Talk 2: Parallelized, multicore, and cloud algorithms for field solvers
Speaker: Dr. Dipanjan Gope, VP Research and Development, Nimbic Inc.

Boundary Element Method (BEM) based electromagnetic field solvers typically involve solving a dense matrix which present a time and memory bottleneck. Over the last two decades, linear scaling iterative solver algorithms have emerged to alleviate the problem to an extent. These methods typically employ matrix compression followed by fast matrix-vector products in a Krylov subspace iterative solution framework. However, analysis of large scale structures such as those encountered in systems-in-package (SiP) entail the solution of large number of basis-functions and many right-hand-sides (RHS), and present significant challenges in terms of memory capacity to fit the compressed matrix, and quick turnaround time required for early design optimization.

The emergence of cloud computing and the corresponding on-demand availability of custom computing instances, presents a unique opportunity to meet the time-memory requirements. In order to harness the true potential of the cloud infrastructure, a multilevel parallelization scheme is adopted. The selection of the type of parallelism employed at each different phase in the hybrid framework depends on a scalability study of the individual components and is guided by Amdahl’s law and the serial content of the underlying algorithms. In this talk, scalable algorithms for boundary element methods are discussed in the context of parallelism. Hierarchies of parallelism including OpenMP-based multicore parallelism, MPI-based multi-CPU parallelism, and distributed computing are examined. Latency challenges endemic in cloud computing are also presented, including solutions to these issues.

It is shown that the combination of scalable fast solvers and multi-scale parallelism allows electromagnetic simulation of complex high-frequency systems in a manner that enables parametric design, variability analysis, and system optimization.

Talk 3: From fields to circuit simulation through passive macromodeling
Speaker: Prof. Stefano Grivet-Talocia, Politecnico di Torino

This talk provides a bridge between electromagnetic simulation and circuit-oriented system verification flows. As discussed during previous talks, an accurate electromagnetic analysis of complex signal and power distribution networks at chip, package, and board level is essential for the assessment of all those parasitic effects that might compromise the performance of the system. However, the results of such analyses must be cast in a form that is useable from the designers within their EDA flows, the latter being almost invariably based on circuit simulators of the SPICE class.

This talk discusses various alternatives for casting the results of an electromagnetic analysis as reduced-order equivalent circuits that naturally fit in a circuit-oriented verification flow. Various alternatives for circuit extraction are discussed, including model order reduction and black-box rational approximation/identification with passivity constraints. The state of the art in passive macromodeling is reviewed and discussed, with emphasis on scalability to large-scale systems having massive port counts and large dynamic orders. Algorithm partitioning and parallelization solutions are presented and illustrated in the context of a cloud computing environment. Future challenges are also discussed, with emphasis on verification flow optimization via tool integration.

WHAT: Moore Meets Maxwell
WHERE: DATE 2012, Exhibition Theatre, Maritim Hotel & Internationales Congress Center Dresden, Germany
WHEN: Thursday, March 15, 2012, 11.00am – 12.30pm
WHO:

Moderator: Dr. Raul Camposano, CEO, Nimbic, Inc.
Organizer: Dr. Raul Camposano, CEO, Nimbic, Inc.
Speakers:
Prof. Vikram Jandhyala, Chair, Department of Electrical Engineering,   University of Washington
Dr. Dipanjan Gope, Vice President of Research and Development, Nimbic
Prof. Stefano Grivet-Talocia, Politecnico di Torino

For additional information on the panel, visit http://www.date-conference.com/conference/session/10.8

About Nimbic

Nimbic is the leading provider of Maxwell-accurate, 3D Full-Wave Electromagnetic Integrity solutions. Nimbic’s nWave 3D field solver enables fast, scalable signal integrity, power integrity and EMI analysis for chip-package-system design. Nimbic’s global customers include Texas Instruments, Renesas, Toshiba, Qualcomm, Tabula and Panasonic. Nimbic’s nCloud secure and scalable cloud compute platform facilitates electromagnetic integrity analysis for the most complex designs cost-effectively and in near real time. Nimbic is headquartered at 2063 Landings Drive, Mountain View, CA.

For additional information, please visit www.nimbic.com

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Media Contact:

Bala Vishwanath, Chief Marketing Officer, Nimbic 800-686-5213 media@nimbic.com

 
Leading EDA Distributor to Provide Sales and Support for Growing Customer Base in Japan
 
TOKYO, JAPAN and MOUNTAIN VIEW, CA – March 1, 2012 – Nimbic, a leading provider of Maxwell-accurate, 3D Full-Wave Electromagnetic Integrity solutions, today announced an exclusive agreement with StayShift Ltd., a leading EDA distributor in Japan. StayShift will immediately begin providing sales and technical support for Nimbic’s growing customer base in Japan.

“Japan is a recognized market for high-technology semiconductor and chip-package-board solutions,” said Keith Morton, Nimbic vice president of worldwide sales. “We are already enabling leading customers in Japan to solve their signal integrity challenges and are seeing an accelerated rate of adoption by additional top-tier companies. By partnering with StayShift, Nimbic is committed to ensuring the long-term success of our customers in Japan.”

StayShift, located in Kanagawa Science Park, Tokyo, Japan, was founded in July 2010. StayShift has professional experience of over 10 years in signal integrity, power integrity and electromagnetic interference analysis for chip-package-board systems. In addition, StayShift works closely with various Japanese institutions and is active in assisting the development of next-generation engineering processes.

“We are delighted to take on the responsibility to expand presence in Japan for a technology leader with cutting-edge solutions to upcoming trends such as 3DIC/TSV and refreshing new business model of delivering EDA solutions in the cloud,” said Tsukasa Okui, President of StayShift. “We are confident that our extensive experience will serve Nimbic well as it enters the next phase of expansion in Japan.”

About Nimbic

Nimbic is the leading provider of Maxwell-accurate, 3D Full-Wave Electromagnetic Integrity solutions. Nimbic’s nWave 3D field solver enables fast, scalable signal integrity, power integrity and EMI analysis for chip-package-system design. Nimbic’s global customers include Texas Instruments, Renesas, Toshiba, Qualcomm, Tabula and Panasonic. Nimbic’s nCloud secure and scalable cloud compute platform facilitates electromagnetic integrity analysis for the most complex designs cost-effectively and in near real time. Nimbic is headquartered at 2063 Landings Drive, Mountain View, CA.

For additional information, please visit www.nimbic.com

About StayShift

StayShift Co., Ltd. is committed to delivering high-performance software solution services related to CDF and EDA. StayShift customizes solutions to customers depending on their specific need for sales and technical support of the software, consulting service and requirements related to multiphysics. StayShift’s mission is to propel continuous innovation of technology, to improve product quality and to drive customer satisfaction.

For additional information, please visit www.stay-shift.jp

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Media Contact:

Bala Vishwanath, Chief Marketing Officer, Nimbic 800-686-5213 media@nimbic.com

Akifumi Nakatani, Ph.D, Technical director of Strategic Business, StayShift Co., Ltd.
044-455-7300 akifumi.nakatani@stay-shift.jp

 
MOUNTAIN VIEW, CA – February 23, 2012 – Nimbic, the leading provider of Maxwell-accurate, 3D Full-Wave Electromagnetic Integrity solutions, today announced that Jim Hogan, Nimbic Board of Director, will join the panel discussion titled “The Resurgence of Chip Design” to be held at DVCon 2012 in San Jose, California.

Over the course of the last decade, many technologists claimed that in the future, the most important part of a new product would be software, not the underlying hardware. Hardware would be a commodity. Everyone would write unique software on top of off the shelf hardware to create a value add. The relevance of chip design, and career prospects for chip designers would be limited.

But what actually happened was quite different. Large technology firms have hired ever-growing teams of engineers to design the custom chips critical to the success of their upcoming products. Building your own ASIC is often the only way to reach the desired power, performance, and cost goals.

The DVCon 2012 Industry Leaders Panel will focus on better understanding the trends driving this resurgence.

WHAT: The Resurgence of Chip Design
WHERE: DVCon 2012, DoubleTree Hotel, San Jose, CA
WHEN: Tuesday, February 28, 2012, 2.30pm – 3.30pm
WHO:
JL Gray – Verilab, Inc. – Moderator
Ted Vucurevich – CEO of Enconcert
John Costello – VP of IC Design at Altera
Gary Smith – Founder and Chief Analyst at Gary Smith EDA
Jim Hogan – Board of Director, Nimbic & Founding Partner, Vista Ventures
Victoria Colemann – VP, Emerging Platforms at Nokia

For additional information on the panel, visit http://dvcon.org/eventdetails?id=131-121

About Nimbic

Nimbic is the leading provider of Maxwell-accurate, 3D Full-Wave EM Integrity solutions. Nimbic’s nWave 3D field solver enables signal integrity, power integrity and EMI analysis for chip-package-system design. Nimbic’s nCloud scalable cloud compute platform facilitates em integrity analysis for complex designs cost-effectively and in near real time. Nimbic’s customers include Texas Instruments, Renesas, Toshiba, Qualcomm & Panasonic. For additional information, visit www.nimbic.com.

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Media Contacts:

Bala Vishwanath, Chief Marketing Officer, Nimbic 800-686-5213 media@nimbic.com

Nimbic’s pay-as-you-go SaaS nCloud solution helps companies achieve tremendous speed-ups in solving chip-packge-system challenges utilizing the power of cloud computing, either on-premise within the enterprise or on the public cloud. Further, smaller companies that do not see the need for a traditional annual subscription or a perpetual license can acquire Nimbic’s nCloud on a pay-per-need basis.

MOUNTAIN VIEW, CA – January 27, 2012 – Nimbic, the leading provider of Maxwell-accurate, 3D Full-Wave Electromagnetic Integrity solutions, today announced that Jim Hogan, Nimbic Board of Director, will join the panel discussion titled “Why Do We Need 3D Design Standards?” to be held at DesignCon 2012 in Santa Clara, California.

This panel will explore whether the design community needs 3D IC standards to accelerate the adoption of 3D design, and if so, how the standards can be implemented, the priority of these required standards, what are the challenges in doing so and how to get started. It will also provide insights on how the many different industry groups are working together to prevent overlapping efforts or missing critical areas. In a typical 3D IC, functional tiers will likely be coming from different companies and at different process nodes, and also different foundries as well. Without effective standards, it is difficult to efficiently integrate different tiers into a common package using best-in-class tools from multiple vendors and test the result. It is not possible to ensure a single EDA vendor flow spanning across the design of tiers designed by different companies.

WHAT: Why Do We Need 3D Design Standards?
WHERE: DesignCon 2012, Santa Clara Convention Center, Santa Clara, California
WHEN: Tuesday, January 31, 2012,  3.45pm – 5.00pm
WHO:
Riko Radojcic (Qualcomm)
Sumit DasGupta (Si2)
Liam Madden (Xilinx)
Raj Jammy (SEMATECH)
Bryon Moyer (Techfocus Media)
Jim Hogan (Nimbic BoD)

Nimbic BOD Jim Hogan on 3D Packaging Standards and Electromagnetic Integrity

For additional information on the panel, visit http://designcon.com/technical_panels

About Nimbic

Nimbic is the leading provider of Maxwell-accurate, 3D Full-Wave EM Integrity solutions. Nimbic’s nWave 3D field solver enables signal integrity, power integrity and EMI analysis for chip-package-system design. Nimbic’s nCloud scalable cloud compute platform facilitates em integrity analysis for complex designs cost-effectively and in near real time. Nimbic’s customers include Texas Instruments, Renesas, Toshiba, Qualcomm & Panasonic. For additional information, visit www.nimbic.com.

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Media Contacts:

Bala Vishwanath, Chief Marketing Officer, Nimbic 800-686-5213 media@nimbic.com

However, with the advent of fast solvers and the possibility of exploiting massive parallelism, it is now possible to compute electromagnetic integrity for one or a few nets in minutes. Integrating such a fast, scalable solver with a design tool would allow designers to check if one net or group of nets works electromagnetically in minutes, while designing them. There now exists the opportunity for the designer to interactively design to the ultimate rather than the nominal.

Looking forward, it is easy to envision design exploration, e.g. alternative placements for sensitive package pins/pads and board balls, routing suggestions for problem traces for package or board routing, and ultimately parametric optimizations based on smart Monte-Carlo analysis that can run “in the background in a cloud”.

Packaging is emerging as a major way to provide speed and density while reducing power and form factor. Verification of these chip-package-systems increasingly requires electromagnetic integrity analysis, driven by frequency, low-voltage, density and 3DIC packaging trends. To address today’s and future system requirements in terms of accuracy, speed and scale, electromagnetic integrity needs an efficient full wave 3D solver and also to exploit parallelism extensively. It also needs to be able to provision the necessary compute resources on demand, e.g. in a cloud. The speed achieved in this manner allows us to envision incorporating electromagnetic integrity analysis into the design cycle. The size of problems that can be solved today allows designers to check electromagnetic integrity for very large systems, thus avoiding system failures, overdesign, reduced performance, lengthy design cycles, reduced profits and ultimately market failure.

nCloud, EDA’s first secure and scalable cloud computing solution, is igniting this new phase. Utilizing nCloud, solutions to even the most complex designs can be delivered cost-effectively in near real time.

nCloud offers multiple advantages

• On-demand provisioning of computing resources in minutes, with virtually unlimited scalability
• A highly secure compute platform
• Resources to exploit parallelism at the tool and at the design-methodology level
• An easy-to-use design environment with pre-installed and ready-to-run design tools
• Reduced need for on-premises hardware IT infrastructure
• Reduced need for upfront purchase of EDA licenses
• A cost-effective pay-for-use and pay-as-you-go software-as-a-service (SaaS) model

Learn more about nCloud Learn more about nWaveRequest Demo